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- JTBD Research Report — Full deep research on org structure and floor roles (34 searches, 10 sources)
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Key Characteristics
- Volume: 100K–1M units/year (medium)
- Customization: Medium — application-specific
- Tolerance: 0.1mm, thermal critical
- Testing: Hi-pot, functional load tests, calibration
- Worker Skill: Inspection to Diagnostic — weeks to years
- Key roles: PCB assembly, wire harness, potting/encapsulation, test techs